Gigabyte

GIGABYTE H610M S2H V2 DDR4 (rev. 1.0) Chipset: Intel® H610 Express Rozměrový formát: Micro ATX (230x215mm) Podpora pro procesory: 13. a 12. generace Intel® Core™, Pentium® Gold a Celeron® Patice procesoru: LGA1700 Paměť: 2x DIMM patice podporu

Technické parametry Pro procesory: Intel Socket (patice): Socket 1700 Chipset: Intel Z790 Počet paměťových slotů: 2 Technologie paměti RAM: DDR5 Formát základní desky: E-ATX Podpora RAID: 0 Podpora RAID: 1 Podpora RAID: 5 Podpora RAID: 10 PCI E

Technické parametry Pro procesory: Intel Socket (patice): Socket 1700 Chipset: Intel Z790 Počet paměťových slotů: 4 Technologie paměti RAM: DDR4 Formát základní desky: ATX Podpora RAID: 0 Podpora RAID: 1 Podpora RAID: 5 Podpora RAID: 10 PCI Exp

Technické parametry Pro procesory: Intel Socket (patice): Socket 1700 Chipset: Intel B760 Počet paměťových slotů: 4 Technologie paměti RAM: DDR5 Formát základní desky: ATX Podpora RAID: 0 Podpora RAID: 1 Podpora RAID: 5 Podpora RAID: 10 PCI Exp

Technické parametry Pro procesory: Intel Socket (patice): Socket 1700 Chipset: Intel B760 Počet paměťových slotů: 4 Technologie paměti RAM: DDR5 Formát základní desky: ATX Podpora RAID: 0 Podpora RAID: 1 Podpora RAID: 5 Podpora RAID: 10 PCI Exp

CPU AMD Socket AM4, support for: AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series and Ryzen™ 3000 and Ryzen™ 3000 G-Series Processors (Please refer "CPU Support List" for more information.) Chipset AMD B550 Memory 4 x DDR4 DIMM soc

GIGABYTE Z790 AORUS ELITE AX-W Chipset: Intel® Z790 Express Rozměrový formát: ATX (305x244mm) Podpora pro procesory: 13. a 12. generace Intel® Core™, Pentium® Gold a Celeron® Patice procesoru: LGA1700 Paměť: 4x DIMM patice podporující až 192GB

GIGABYTE B760 DS3H AX Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution Dual Channel DDR5:4*DIMMs XMP Memory Module Support Next Generation Storage:2*PCIe 4.0 x4

GIGABYTE B760 DS3H AX Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution Dual Channel DDR5:4*DIMMs XMP Memory Module Support Next Generation Storage:2*PCIe 4.0 x4

GIGABYTE B760M DS3H (rev. 1.0) Chipset: Intel® B760 Express Rozměrový formát: Micro ATX (244x244mm) Podpora pro procesory: 13. a 12. generace Intel® Core™, Pentium® Gold a Celeron® Patice procesoru: LGA1700 Paměť: 4x DIMM patice podporující až

CPU LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors* L3 cache varies with CPU * Please refer to "CPU Support List" for more information. Chipset Intel® Z790 Express Chipset Memory Support

CPU LGA1700 socket: Support for the 13th and 12thGeneration Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU (Please refer to "CPU Support List" for more information.) Chipset Intel® B760 Express Chipset Memory Support f

CPU LGA1200 package: 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/

CPU LGA1200 package: 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/

Intel Wireless-AC 9260 included IEEE 802.11ac standards compliant Antenna supports WLAN 2Tx2R transmission High speed wireless connection up to 1733 Mbps BLUETOOTH 5

Case Form Factor Mid Tower M/B Type mini-ITX/m-ATX/ATX Color Black Materials Steel, Plastic, Glass Dimensions H= 469 W= 211 D= 458mm (Within ± 1% error) Expansion slots 7 or 2 (Requires PCIE Riser Cable) 5.25" Drive Bays None 3.5“/2.5” Drive Bays

AMD B550 Gaming Motherboard with Digital VRM Solution, GIGABYTE Gaming LAN with Bandwidth Management, PCIe 4.0/3.0 x4 M.2, RGB FUSION 2.0, Smart Fan 5 ,Q-Flash Plus , Anti-Sulfur Resistors Design Supports 3rd Gen AMD Ryzen™ Processors Dual Channel ECC

AMD B550 Ultra Durable Motherboard with Pure Digital VRM Solution, PCIe 4.0 x16 Slot, Dual PCIe 4.0/3.0 M.2 Connectors, GIGABYTE 8118 Gaming LAN, Smart Fan 5 with FAN STOP, RGB FUSION 2.0, Q-Flash Plus Supports 3rd Gen AMD Ryzen™ Processors Dual Chan

AMD B550 Ultra Durable Motherboard with Pure Digital VRM Solution, PCIe 4.0 x16 Slot, Dual PCIe 4.0/3.0 M.2 Connectors, GIGABYTE 8118 Gaming LAN, Smart Fan 5 with FAN STOP, RGB FUSION 2.0, Q-Flash Plus Supports 3rd Gen AMD Ryzen™ Processors Dual Chan

AMD A520 Ultra Durable Motherboard with Pure Digital VRM Solution, GIGABYTE Gaming LAN with Bandwidth Management, PCIe 3.0 x4 M.2, RGB FUSION 2.0, Smart Fan 5, Q-Flash Plus, Anti-Sulfur Resistors Design Supports 3rd Gen AMD Ryzen™ Processors Dual Chan

AMD A520 Ultra Durable Motherboard with Pure Digital VRM Solution, GIGABYTE Gaming LAN with Bandwidth Management, PCIe 3.0 x4 M.2, RGB FUSION 2.0, Smart Fan 5, Q-Flash Plus, Anti-Sulfur Resistors Design Supports 3rd Gen AMD Ryzen™ Processors Dual Chan

Model: P550B Typ: Intel Form Factor ATX 12V v2.31 PFC: Active PFC Výkon: 550W Typ ventilátoru: 120mm Hydraulic Bearing Fan 80 PLUS: Bronze Konektory: 1x ATX/MB 20+4 Pin 1x CPU/EPS 4+4 Pin 2x PCI-e 6+2 Pin 6x SATA 3x 4 Pin Peripheral 1x 4

Interface SATA 6.0Gb/s Form Factor 2.5-inch internal SSD Total Capacity 240GB Warranty Limited 3-year or 100TBW NAND NAND Flash External DDR Cache N/A Sequential Read speed Up to 500 MB/s Sequential Write speed Up to 420 MB/s Random Read IOPS up t

Interface SATA 6.0Gb/s Form Factor 2.5-inch internal SSD Total Capacity 120GB Warranty Limited 3-year or 75TBW NAND NAND Flash External DDR Cache N/A Sequential Read speed up to 500 MB/s ; Minimum 350 MB/s Sequential Write speed up to 380 MB/s ; Mi

ATC800 6 x O6mm copper direct pipe, efficiently dissipates 200W CPU heat. 2 x 12cm 2 ball bearing RGB fan. Supports RGB FUSION 2.0 synchronization with other AORUS devices. CPU Temp and RPM indicator, easy to monitor CPU status. Memory compatibility

Features Stylish RGB Light on Black Tempered Glass Front panel With RGB LED Switch and 2 USB 3.0 on I/O Panel Full-Size Black Tempered Glass Side Panel PSU Shroud Design Detachable Dust Filter Liquid Cooling Compatible Case Form Factor Mid Tower

Velikost: M.2 2280 Rozhraní: PCI-Express 3.0 x4, NVMe 1.3 Celková kapacita: 256GB* Záruka: Limited 5-years or 300TBW Rychlost sekvencního ctení: až 1700 MB/s** Rychlost sekvencního zápisu: až 1100 MB/s** HMB (Host Memory Buffer) supported Podpora

Velikost: M.2 2280 Rozhraní: PCI-Express 3.0 x4, NVMe 1.3 Celková kapacita: 128GB* Záruka: Limited 5-years or 110TBW Rychlost sekvencního ctení: až 1550 MB/s** Rychlost sekvencního zápisu: až 550 MB/s** HMB (Host Memory Buffer) supported Podpora TR

Features Powered by GeForce® GT 1030 Integrated with 2GB GDDR5 64bit memory Supports HDMI 4K@60Hz Smooth 4K video playback and HTML5 web browsing One-click overclocking via AORUS Graphics Engine Core Clock Boost: 1544 MHz/ Base: 1290

Graphics Processing GeForce® GT 1030 Core Clock Boost: 1417 MHz/ Base: 1177 MHz in OC Mode Boost: 1379 MHz/ Base: 1151 MHz in Gaming Mode CUDA® Cores 384 Memory Clock 2100 MHz Memory Size 2 GB Memory Type DDR4 Memory Bus 64 bit Digital max reso

Type Headphone : STEREO Microphone : Unidirectional Driver Diameter Headphone : 50mm Microphone : 4*2mm Impedance Headphone : 32? Microphone : 2.2K? Frequency Response Headphone : 20Hz~20KHz Microphone : 100Hz~10KHz Sensitivity Headphone : 100 ± 3

Model: GIGABYTE zdro AORUS P850W 80+ GOLD Modular Certifikace 80 PLUS Gold Výkon 850W Modulárnost: Plně modulární Konektory: 20+4PIN MB 6xPCI-E(6+2PIN) 6xSATA + 2xPeripheral 3xPeripheral + 2xFLOPPY 2xCPU(4+4PIN) Výkon zdroje (W) 850

Features Fully Modular Design High quality 100% Japanese Capacitors 135mm 2 ball bearing smart fan with fan stop function 80 PLUS Gold certified: above 90% efficiency at 50% load Single +12V rail OCP/OTP/OVP/OPP/UVP/SCP protection 10 years warranty

Chipset: AMD B550 Rozměrový formát: ATX Form Factor (305 mm x 244 mm) Podpora pro procesory: 3. generaci procesorů AMD Ryzen™ / 3. generaci procesorů AMD Ryzen™ s grafickým adaptérem Radeon™ Patice procesoru: AM4 Pozice na paměti: 4x DDR4 DIMM Po

Chipset: AMD B550 Rozměrový formát: ATX Form Factor (305 mm x 244 mm) Podpora pro procesory: 3. generaci procesorů AMD Ryzen™ / 3. generaci procesorů AMD Ryzen™ s grafickým adaptérem Radeon™ Patice procesoru: AM4 Pozice na paměti: 4x DDR4 DIMM Po

AMD B550 Mini-ITX AORUS Motherboard with Direct 8 Phases Digital VRM, Advanced Thermal Design with Extended VRM Heatsink, Thermal Baseplate, Dual PCIe 4.0/3.0 M.2 with Thermal Guard, Intel® WiFi 6 802.11ax, 2.5GbE LAN, RGB FUSION 2.0, Q-Flash Plus Supp

Digitální LCD monitor Certifikace 80 PLUS Platinum Plně modulární konstrukce 100 % japonských kondenzátorů Konstrukce s kompaktními rozměry 140mm inteligentní ventilátor s dvojitými kuličkovými ložisky Funkce odstraňování prachu ventilátorem Jediná

Graphics Processing Radeon™ RX 6500 XT Core Clock Boost Clock* : up to 2825 MHz (Reference card: 2815 MHz) Game Clock* : up to 2685 MHz (Reference card: 2610 MHz) Stream Processors 1024 Process Technology 6 nm Memory Clock 18000 MHz Memory Size

New high performance pump efficiently dissipates heat from high end CPUs. Unique 60x60mm circular full color LCD, video play/ custom text support. Adjustable screen orientation can be rotated 330 degrees. High performance, low-noise level, Graphene Nan

New high performance pump efficiently dissipates heat from high end CPUs. AORUS ARGB lighting display. Adjustable screen orientation can be rotated 330 degrees. High performance, low-noise level, Graphene Nano Lubricant ARGB fans. Supports RGB FUSION